Keep thermal performance stable under sustained load with TG 30 Thermal Compound. Formulated with diamond powder, this 4 g compound is designed to move heat away from the CPU efficiently, helping maintain lower operating temperatures and extend component life. The formulation is intended to resist dry-out and cracking, which matters when a system is expected to run for long periods without maintenance. TG 30 also addresses one of the most common pain points in thermal paste installation: uneven coverage. The included application tools and honeycomb stencil help guide a cleaner, more uniform spread across the CPU surface, reducing waste and improving contact consistency. That makes it a practical choice for builders, technicians, and system integrators who want repeatable results across multiple installs. For premium desktop builds, workstation refreshes, or maintenance cycles on performance systems, TG 30 offers a more controlled application experience than basic pastes. It is a small component with outsized impact, especially when thermal headroom, acoustic behavior, and long-term reliability all matter.