The RP1155 is a light gray ABS water-tight enclosure with an opaque lid, measuring 4.92 in x 3.35 in x 3.35 in (125 mm x 85 mm x 85 mm). It gives electronics designers, OEM engineers and panel builders a sealed general-purpose housing for printed circuit boards or components.

The body is general purpose ABS plastic with a UL94 HB flame rating. A two-piece tongue and groove lid joint with a rubber gasket (supplied loose for field installation; the drawing specifies an EPDM grey string gasket) protects against the access of oil, dust and water, and the lid carries a smooth recessed area for a membrane, label or silkscreen.

This is the tallest 85 mm version of the 125 x 85 mm RP footprint, with 78.50 mm of inside height for stacked or tall components on a PC board up to 117 x 77 mm. The drawing gives overall dimensions of 125.50 mm [4.94 in] long, 86.00 mm [3.39 in] wide and 85.00 mm [3.35 in] high, with inside dimensions of 118.71 mm [4.67 in] long, 78.71 mm [3.10 in] wide and 78.50 mm [3.09 in] high. The series ordering table lists this size as 4.96 in (126 mm) x 3.39 in (86 mm) x 3.35 in (85 mm). Shipping weight is 0.49 lbs (0.22 kg).

Each purchased assembly includes the box, lid, string gasket, four PCB screws and four lid screws. The lid is secured with self-captivating M3.5 stainless steel machine screws threaded into corrosion resistant bushings for repeated assembly and disassembly; recommended torque is 43-50 ozf.in (30-35 cN.m). Internal mounting holes accept M3 self-tapping screws, and optional inner panels are available as STC113 (3 mm black ABS) or STA113 (1 mm metal).

The RP1155 is designed to meet IP65 and is RoHS and REACH compliant. Hammond cautions that acetone, ketones, thread-locking compounds, cutting fluids and strong solvents can damage ABS and polycarbonate enclosures, so check chemical compatibility before use.